| CAS登錄號(hào) | 中文名 | 英文名 | 分子結(jié)構(gòu)式 | 分子式 | 詳情 | 供應(yīng)商 |
| 14025-15-1 | 乙二胺四乙酸銅鈉; 乙二胺四乙酸二鈉銅鹽; EDTA銅鈉鹽 | Copper disodium EDTA; Copper disodium ethylenediaminetetraacetate |  | C10H12CuN2Na2O8 | 詳情 | 供應(yīng)商 |
| 23299-85-6 | 銅-PAN絡(luò)合物(Cu-EDTA+PAN) | COPPER PAN (Cu-EDTA + PAN); COPPER PAN (Cu-EDTA + PAN); COPPER PAN GR; Copper(II)bis[1-(2-pyridylazo)naphthalene-2-olate] | 無(wú) | C30H20CuN6O2 | 詳情 | 供應(yīng)商 |
| 61916-40-3 | EDTA DISODIUM CuPRIC SALT; EDTA DISODIUM CuPRIC SALT; EETHYLENEDINITRILO)TETRAACETIC ACID COPPER DISODIUM SALT 97%; EDTA DISODIUM CuPRIC SALT 97%; COPPERDISODIUMEDTADIHYDRATE; Ethylenediaminetetraacetic acid, copper(II) disodium salt dihydrate,98%; Cuprate(2-), ((N,N'-1,2-ethanediylbis(N-(carboxymethyl)glycinato))(4-)-N,N',o,o',on,on')-, disodium, dihydrate, (oc-6-21)-; Disodium Cupric ethylenediaminetetracetate dihydrate |  | C10H12CuN2Na2O8 | 詳情 | 供應(yīng)商 |