| CAS登錄號 | 中文名 | 英文名 | 分子結(jié)構式 | 分子式 | 詳情 | 供應商 |
| 67989-88-2 | EDTA-銅銨絡合物; 乙二胺四乙酸銅二銨 | Ethylenediaminetetraacetate-copper-ammonia complex; Ethylenediaminetetraacetic acid diammonium copper salt |  | C10H20CuN4O8 | 詳情 | 供應商 |
| 67689-49-0 | [N,N',N'',N'''-四[3-(二甲氨基)丙基]-29H,31H-酞菁-C,C,C,C-四磺酰胺合銅-N29,N30,N31,N32]絡合物 | [N,N',N'',N'''-tetrakis[3-(dimethylamino)propyl]-29H,31H-phthalocyanine-C,C,C,C-tetrasulfonamCopper | 無 | C52H64CuN16O8S4 | 詳情 | 供應商 |
| 93971-95-0 | 29H,31H-酞菁磺酰胺-N-[3-(二乙氨基)丙基]銅絡合物 | 29H, 31H-Phthalocyaninesulfonamide, N-[3-(diethylamino) propyl]-copper complex(9Cl); Copper,[N-[3-(diethylamino)propyl]-29H,31H-phthalocyanine-C-sulfonamidato(2-)-N29,N30,N31,N32]-; 29H,31H-Phthalocyanine-C-sulfonamide, N-[3-(diethylamino)propyl]-, coppercomplex |  | C39H32CuN10O2S | 詳情 | 供應商 |
| 34836-53-8 | 碘化銅三甲基亞磷酸絡合物 | Copper, iodo(trimethylphosphite-kP)- (9CI); (Trimethylphosphite)copper iodide (7CI); Copper, iodo(phosphorous acid)-, trimethyl ester(8CI); Copper, iodo(trimethyl phosphite-P)-; Iodo(trimethyl phosphite)copper |  | C3H9CuI2O3P | 詳情 | 供應商 |
| 23299-85-6 | 銅-PAN絡合物(CU-EDTA+PAN) | COPPER PAN (CU-EDTA + PAN); COPPER PAN (CU-EDTA + PAN); COPPER PAN GR; Copper(II)bis[1-(2-pyridylazo)naphthalene-2-olate] | 無 | C30H20CuN6O2 | 詳情 | 供應商 |
| 51913-38-3 | 三氟甲烷磺酸銅與甲苯的絡合物; 三氟甲烷磺酸銅與甲苯的絡合物 | COPPER(I) TRIFLUOROMETHANESULFONATE |  | CCuF3O3S | 詳情 | 供應商 |